2026年1月6日 — オプトランス株式会社は、長年培ってきた半導体プロセス技術と精密アセンブリ技術を活かし、LEDおよびフォトダイオード向けのトランスファーモールド光学パッケージング技術を開発しています。
本ソリューションは、光学性能と信頼性を同時に向上させつつ、コンパクト実装と量産スケーラビリティを両立し、産業・医療・計測などの高要求アプリケーションに適したプラットフォームを提供します。
1. トランスファーモールドパッケージとは
トランスファーモールドパッケージは、LEDチップやフォトダイオードチップ上に、光学レンズ／ライトシールド／ハウジング形状などの構造を樹脂モールドで一体形成するパッケージング技術です。
従来のようにレンズキャップや反射カップを別部品で組み立てるのではなく、モールドコンパウンド内に光学機能と機械強度を集約することで、以下を実現します。
オプトランスのトランスファーモールドLEDパッケージは、RCLED・QWLEDなどの点光源デバイスに特化した設計が可能です。
フォトダイオードでも、検出感度と高速応答の両立に貢献します。
トランスファーモールド構造は、ダイおよびワイヤボンドを樹脂で一体保護し、次のメリットを提供します。
また、個別部品を使わないため外形を小型化でき、JEDEC/IPC準拠のSMDフットプリントで提供可能です。PCB上の搭載密度を高めつつ、光学性能と長期信頼性を両立します。
対応可能なカスタム例：
代表用途：
評価サンプル、カスタム設計、共同開発のご相談を承っております。置き換え検討、光学性能改善、実装面積削減など、設計段階からご支援します。
技術的なご相談・お問い合わせ（英語）：in**@************ca.com
日本語サポート：Optrans Japan経由で対応可能
TEL：044-932-6491 / +81-44-932-6491
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January 6, 2026 — Optrans Corporation is developing transfer molding optical packaging technology for LEDs and photodiodes, leveraging its long-standing expertise in semiconductor process technology and precision assembly technology. This solution simultaneously improves optical performance and reliability while achieving compact packaging and mass production scalability, providing a platform suitable for demanding applications in industrial, medical, and measurement fields. 1. What is Transfer Molding Packaging? Transfer molding packaging is a packaging technology that integrates structures such as optical lenses, light shields, and housing shapes onto LED or photodiode chips using resin molding. Instead of assembling lens caps and reflective cups as separate components, as in conventional methods, this technology integrates optical functions and mechanical strength within the mold compound, achieving the following: Consistent optical geometry and alignment accuracy High-density mounting with a small and thin footprint Excellent resistance to vibration, shock, and temperature cycles High reproducibility and cost-effectiveness suitable for mass production 2. Features of Transfer Molding for LEDs Optrans’ transfer molding LED packages can be designed specifically for point light source devices such as RCLEDs and QWLEDs. Integration of primary optics Molded lenses enable the implementation of lens profiles optimized for beam shaping, collimation, and fiber/aperture coupling at the package level. Suitable for applications requiring sub-millimeter precision alignment (encoders, position sensors, medical and measurement light sources, etc.) Optimization of transmission wavelength through material design The mold material allows for the design of transmission characteristics according to the application, from UV/visible/NIR/SWIR. Expected to improve effective utilization of radiant flux and optical efficiency. Spectral control through phosphor incorporation Phosphors are directly dispersed in the resin compound to convert and expand the LED spectrum. White light/multi-wavelength/specific peak wavelength light sources can be configured at the package level without external phosphor plates or filters. 3. Transfer Molding Packaging for Photodiodes This technology also contributes to achieving both high detection sensitivity and fast response in photodiodes. Integrated Optical Filters and Lenses Molded lenses and optical filter functions are integrated into the resin, controlling the shape and angle of incident light. Stray light and parasitic reflections are reduced, concentrating sensitivity to the target band → Improved S/N ratio Reduced parasitic capacitance and high-speed response Epoxy-based molds generally have a lower dielectric constant than ceramic/metal. Suppresses package parasitic capacitance, advantageous for applications requiring fast rise time and broadband detection. Integrated Optical Filters The mold compound itself incorporates bandpass/notch functions, completing transmission and blocking in a small package. Miniaturization and reduction of component count in analytical measurement, spectroscopic sensors, and environmental monitoring. 4. Reliability, Environmental Resistance, and High-Density Mounting The transfer mold structure integrally protects the die and wire bonds with resin, providing the following benefits: Improved resistance to vibration, shock, and thermal cycling Reduced risk of wire bond peeling/breakage Furthermore, because individual components are not used, the external dimensions can be miniaturized, and it can be provided with a JEDEC/IPC compliant SMD footprint. This allows for increased mounting density on the PCB while maintaining both optical performance and long-term reliability. 5. Custom Design and Application Examples Examples of customizable features: Optimization of chip size/active area/package height Custom design of lens curvature/beam angle Presence or absence of phosphor, filter layers, and light shielding structures Optimization of combinations with RCLED/QWLED/various photodiodes Typical applications: Industrial sensors/encoders/distance meters Light sources and detectors for medical and life sciences Environmental and gas sensing, UV monitoring High-reliability optoelectronics for aerospace and defense 6. Technical Consultation and Collaborative Development We offer consultations on evaluation samples, custom designs, and collaborative development. We provide support from the design stage, including replacement considerations, optical performance improvement, and reduction of mounting area. Technical inquiries and support (English): in**@************ca.com Japanese support: Available through Optrans Japan TEL: 044-932-6491 / +81-44-932-6491